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Thermal Conductive Sheet - Company Ranking(12 companies in total)

Last Updated: Aggregation Period:Oct 29, 2025〜Nov 25, 2025
This ranking is based on the number of page views on our site.

Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
Model number: WW-TGA1450 Thermal conductivity: 14.5 W/m·K (ASTM D5470) Size: 30mm × 30mm × thickness 0.5mm Hardness: 60 shore 00 Den... - For cooling the CPU of a computer and the GPU of a graphics card - Ideal for cooling Intel Socket LGA115x CPUs.
Model number: WW-TGA1780 Thermal conductivity: 17.8W/m・K (ASTM D5470) Base polymer: Silicone Size: 30mm x 30mm x thickness 0.5mm Har... - For cooling the CPU of a computer and the GPU of a graphics card - Ideal for cooling Intel Socket LGA115x CPUs.
Model number: WW-TGA6200 Dimensions: 30mm × 30mm × thickness 0.5mm Thermal conductivity: 6.2 W/m·K Flame retardancy: V-0 UL-94 Diele... ● Thermal management of heat-generating components in electronic and electrical devices. ● Heat dissipation measures for CPUs and ICs. ●...
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  1. Featured Products
    T-Global ultra-high thermal conductivity heat dissipation sheet thermal conductivity 14.5 W/m·KT-Global ultra-high thermal conductivity heat dissipation sheet thermal conductivity 14.5 W/m·K
    overview
    Model number: WW-TGA1450 Thermal conductivity: 14.5 W/m·K (ASTM D5470) Size: 30mm × 30mm × thickness 0.5mm Hardness: 60 shore 00 Den...
    Application/Performance example
    - For cooling the CPU of a computer and the GPU of a graphics card - Ideal for cooling Intel Socket LGA115x CPUs.
    T-Global ultra-high thermal conductivity heat dissipation sheet thermal conductivity 17.8 W/m·KT-Global ultra-high thermal conductivity heat dissipation sheet thermal conductivity 17.8 W/m·K
    overview
    Model number: WW-TGA1780 Thermal conductivity: 17.8W/m・K (ASTM D5470) Base polymer: Silicone Size: 30mm x 30mm x thickness 0.5mm Har...
    Application/Performance example
    - For cooling the CPU of a computer and the GPU of a graphics card - Ideal for cooling Intel Socket LGA115x CPUs.
    T-Global high thermal conductivity sheet thermal conductivity 6.2 W/m·KT-Global high thermal conductivity sheet thermal conductivity 6.2 W/m·K
    overview
    Model number: WW-TGA6200 Dimensions: 30mm × 30mm × thickness 0.5mm Thermal conductivity: 6.2 W/m·K Flame retardancy: V-0 UL-94 Diele...
    Application/Performance example
    ● Thermal management of heat-generating components in electronic and electrical devices. ● Heat dissipation measures for CPUs and ICs. ●...